Advantages of Heat Sinks and Semiconductor Base Plates Made from Molybdenum Copper Alloy

Thermal management and packaging components, such as heat spreaders and semiconductor base plates, are used to regulate the temperature of electronic systems and help to control operating temperatures of high-power semiconductor devices. Effective thermal management components use cost-effective, composite materials that possess high thermal conductivity and low thermal expansion.

Molybdenum copper high performance composites are fabricated from carefully controlled molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.

Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.

It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.

The advantages of heat sinks provided by Chinatungsten, heat spreaders, semiconductor base plates, and substrates lie in the thermal material properties. Their controlled CTE (coefficient of thermal expansion) perfectly matches with semiconductor and ceramic packaging materials. When used in combination with high TC (thermal conductivity), thermal management and packaging components remove heat rapidly from high powered electronic devices.

The CTE of our materials is adjustable whilst also maintaining high thermal conductivity, which makes our engineered thermal materials ideal for high-reliability electronics that generate considerable amounts of heat.

If you have any inquiry of MoCu heat sinks, please feel free to contact us:
Email: sales@chinatungsten.com/sales@xiamentungsten.com
Tel.: +86 592 5129696/+86 592 5129595

Fax: +86 592 5129797

Scan QR code of Chinatungsten Wechat platform to follow up the daily latest price and market of tungsten, molybdenum and rare earth.

Molybdenum Copper Alloy Is Used to Produce Heat Sinks for Vacuum Electronic Devices

In the electronics industry, materials of aluminum and copper are widely used as contacts and heat sinks because they are good thermal conductors. However, due to high coefficient of thermal expansion, they are unable to be used as substrate materials for semiconductors that bear considerable thermal load.

The molybdenum-copper composite material combines high thermal and electrical conductivity of copper and low thermal expansion of molybdenum, with many characteristics of find structure, good electrical and thermal conductivity and low coefficient of thermal expansion. Therefore, molybdenum copper alloy material has wide applications. 

1. Electrical contacts for vacuum switches

Both tungsten copper and molybdenum copper alloy materials can be applicable. Which materials to be elected depends on the requirements of vacuum switches. Choosing the suitable material is able for vacuum switch to achieve the best use effect of the materials.

2. Heat sinks for vacuum electronic devices

Development of millimeter and submillimeter-band vacuum electronic devices put forward special requirements to the properties of structural materials for microfabrication of such basic electronic components as slow-wave structures. One of the promising composite materials for vacuum microelectronic devices is molybdenum-copper alloys.

3. Instrumental components

Due to the many physical properties of molybdenum copper material, such as non-magnetic, constant thermal expansion coefficient, high elastic modulus, high electrical and thermal conductivity, etc., it is suitable for some special requirements of instrument components. In addition, moly copper material has lower density, lighter weight, good plasticity and convenient machining than tungsten cooper material, which is more suitable to be used as instrument materials.

4. Parts of rockets and missiles

MoCu material is more resistant to ablation than molybdenum, and has more plasticity and workability. Therefore, it can replace molybdenum as parts in other weapons, such as extended range guns. 

As a professional manufacturer over two decades, Chinatungsten offers various grades of MoCu products, such as Mo75Cu25, Mo70Cu30. If you have any purchasing plan, kindly feel free to contact us. 

If you have any inquiry of molybdenum copper products, please feel free to contact us:
Email: sales@chinatungsten.com/sales@xiamentungsten.com
Tel.: +86 592 5129696/+86 592 5129595

Fax: +86 592 5129797

Scan QR code of Chinatungsten Wechat platform to follow up the daily latest price and market of tungsten, molybdenum and rare earth.