What Are the Benefits of Metal Plating on Molybdenum Copper Alloy

Molybdenum is a non-ferrous metal with high melting point, high strength, high hardness, wear resistance, and good thermal and electrical conductivity, while molybdenum copper alloy (Cu-Mo alloy) is a pseudo-alloy made by copper and molybdenum that does not solidify with each other.

This alloy contains less copper, so it basically possesses most of the physical and chemical properties of molybdenum, and also has the characteristics of copper at the same time, that is, it has high electrical conductivity, high thermal conductivity, small expansion coefficient, good corrosion resistance, non-magnetic and good processing properties, etc.

Given the broad application prospects., the material is widely used in many fields such as metallurgy, machinery, petroleum, chemical industry, national defense, aerospace, electronics, nuclear industry and so on. There are mainly: vacuum contacts, conductive heat dissipation components, instrumentation components, rockets that are used at a slightly lower temperature, high-temperature components of missiles, and components in other weapons, such as range extenders. At the same time, it is also used for solid sealing, sliding friction reinforcing ribs, water-cooled electrode heads in high-temperature furnaces, and electro-machined electrodes.

In actual use, molybdenum-copper alloys are often subjected to surface modification treatments such as electroplating and coating to meet specific functional requirements on their surfaces, such as high-temperature brazing and reducing contact resistance. However, the surface of Cu-Mo alloy is very easy to oxidize, and the chemical properties of the oxide film are very stable, the surface wettability is poor, and it is very difficult to perform surface treatment. Therefore, the gold plating can greatly improve its conductivity and brazing performance. It meets the application requirements in military electronics and aerospace products.

For regular metal plating, Ni, NiAu, NiAg, or Au plating are the most common. The thickness of plating is about 3~5 microns and gold plating is about 1 micron. Sometimes, AuSn plating is required. 

Chinatungsten Online can provide customized molybdenum copper alloy with effective thermal conductivity and good high-temperature tolerance.

If you have any inquiry of gold plated molybdenum copper carrier, please feel free to contact us:
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Advantages of Heat Sinks and Semiconductor Base Plates Made from Molybdenum Copper Alloy

Thermal management and packaging components, such as heat spreaders and semiconductor base plates, are used to regulate the temperature of electronic systems and help to control operating temperatures of high-power semiconductor devices. Effective thermal management components use cost-effective, composite materials that possess high thermal conductivity and low thermal expansion.

Molybdenum copper high performance composites are fabricated from carefully controlled molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.

Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.

It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.

The advantages of heat sinks provided by Chinatungsten, heat spreaders, semiconductor base plates, and substrates lie in the thermal material properties. Their controlled CTE (coefficient of thermal expansion) perfectly matches with semiconductor and ceramic packaging materials. When used in combination with high TC (thermal conductivity), thermal management and packaging components remove heat rapidly from high powered electronic devices.

The CTE of our materials is adjustable whilst also maintaining high thermal conductivity, which makes our engineered thermal materials ideal for high-reliability electronics that generate considerable amounts of heat.

If you have any inquiry of MoCu heat sinks, please feel free to contact us:
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Tel.: +86 592 5129696/+86 592 5129595

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Molybdenum Copper Alloy Is Used to Produce Heat Sinks for Vacuum Electronic Devices

In the electronics industry, materials of aluminum and copper are widely used as contacts and heat sinks because they are good thermal conductors. However, due to high coefficient of thermal expansion, they are unable to be used as substrate materials for semiconductors that bear considerable thermal load.

The molybdenum-copper composite material combines high thermal and electrical conductivity of copper and low thermal expansion of molybdenum, with many characteristics of find structure, good electrical and thermal conductivity and low coefficient of thermal expansion. Therefore, molybdenum copper alloy material has wide applications. 

1. Electrical contacts for vacuum switches

Both tungsten copper and molybdenum copper alloy materials can be applicable. Which materials to be elected depends on the requirements of vacuum switches. Choosing the suitable material is able for vacuum switch to achieve the best use effect of the materials.

2. Heat sinks for vacuum electronic devices

Development of millimeter and submillimeter-band vacuum electronic devices put forward special requirements to the properties of structural materials for microfabrication of such basic electronic components as slow-wave structures. One of the promising composite materials for vacuum microelectronic devices is molybdenum-copper alloys.

3. Instrumental components

Due to the many physical properties of molybdenum copper material, such as non-magnetic, constant thermal expansion coefficient, high elastic modulus, high electrical and thermal conductivity, etc., it is suitable for some special requirements of instrument components. In addition, moly copper material has lower density, lighter weight, good plasticity and convenient machining than tungsten cooper material, which is more suitable to be used as instrument materials.

4. Parts of rockets and missiles

MoCu material is more resistant to ablation than molybdenum, and has more plasticity and workability. Therefore, it can replace molybdenum as parts in other weapons, such as extended range guns. 

As a professional manufacturer over two decades, Chinatungsten offers various grades of MoCu products, such as Mo75Cu25, Mo70Cu30. If you have any purchasing plan, kindly feel free to contact us. 

If you have any inquiry of molybdenum copper products, please feel free to contact us:
Email: sales@chinatungsten.com/sales@xiamentungsten.com
Tel.: +86 592 5129696/+86 592 5129595

Fax: +86 592 5129797

Scan QR code of Chinatungsten Wechat platform to follow up the daily latest price and market of tungsten, molybdenum and rare earth.

Molybdenum Copper Alloy Properties

Molybdenum copper is alloy of molybdenum and copper. It is a great alternative to tungsten copper for weight sensitive applications, with many good properties.

1. High electrical and thermal conductivity. Molybdenum is a better element for electricity conductivity except for gold, silver and copper in the metals. Therefore, molybdenum copper alloy composed by molybdenum and copper have very high electrical and thermal conductivity.

2. Adjustable low coefficient of thermal expansion. The coefficient of thermal expansion of copper is higher, but the coefficient of thermal expansion of molybdenum is very low. Therefore, the low coefficient of thermal expansion can be made by different proportion of the components according to the requirements, in order to make them appropriate and combine with other materials, avoid the damage of thermal stress caused by large differences in coefficient thermal expansions.

3. Special high temperature property. The melting point of molybdenum is 2 610, and the melting point of copper is only 1083, molybdenum-copper alloy have good strength property and definite plasticity in ordinary temperature. And if the temperature exceeds the melting point of copper, the copper will change to liquid and evaporate to absorb heat, to make cooling effect. This performance can be used as special-purpose high-temperature materials, such as the nozzle throat which can be resist combustion temperature of gunpowder, electrical contact which under high-temperature electric arc, and so on.

4. Molybdenum copper alloy is non-magnetic. Both molybdenum and copper are non-magnetic non-ferrous metals. Hence the composition of Mo-Cu alloy is an excellent non-magnetic material.

5. Molybdenum copper alloy has low gas content and a good vacuum performance. Either molybdenum or copper, its oxides easy to restore, their N, H, C and other impurities can easily be removed, thereby maintaining low outgassing and makes full use of performance of the vacuum.

6. Molybdenum copper alloy has good machinability. Because of high hardness and brittleness, it is difficult to machine the pure molybdenum. Mo-Cu alloy, because of copper's incorporation, the hardness reduced and plasticity increases, so it is beneficial to machining, and can be processed into complex shapes components.

If you have any inquires concerning molybdenum products, please don't hesitate to e-mail us by : sales@chinatungsten.com or info@chinatungsten.com