Molybdenum Wafer Is Used as Heat-sinker for LED chips

Molybdenum wafer is a circular sheet made of molybdenum material, usually with a diameter of 0.1mm to 2.0mm. It usually has high density, good mechanical properties and corrosion resistance, and can be used to manufacture various high-temperature and corrosion-resistant parts. 

From the point of view of appearance, they are generally dark brown, but after alkali washing, they are usually silver gray with high gloss. The surface is smooth and flat, without heavy skin, delamination, inclusion of impurities, and cracks, and defects such as cracked edges.

From the point of view of physical and chemical properties, they have high melting point (2620°C), density (10.2g/cm3), hardness (Mohs hardness is 5~5.5) and strength, lower coefficient of thermal expansion and resistivity, and higher high conductivity, good chemical stability, high temperature creep resistance, oxidation resistance, high temperature resistance and corrosion resistance.

There are two main production methods for molybdenum wafers, one is powder metallurgy, and the other is cold rolling. The powder metallurgy method is to mix molybdenum powder with other alloying elements, and then form it into wafers by pressing. The cold-rolling method is to make molybdenum plate blanks through high-temperature and high-pressure rolling, and then perform annealing and alkali cleaning to obtain thin molybdenum sheets. 

As molybdenum has the characteristics of high melting point, high strength, high hardness, low thermal expansion coefficient and excellent corrosion resistance, molybdenum wafers are widely used in aerospace, electronics, semiconductor, chemical and other fields, such as for the manufacture of vacuum furnace interior components, high-temperature heating elements, X-ray tube windows, linings of molten glass kettles, etc. In addition, our pure molybdenum is the ideal materials as heat-sinker for bonding to LED chips.

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