Molybdenum Wafers Are Used as Substrates of Silicon Controlled Rectifier (SCR)

Molybdenum wafers are made of pure molybdenum material with purity over 99.95%, which can be used in high temperature technology, electronic devices, aerospace, chemical industry, and other fields due to their characteristics of high temperature, high strength and high stability.

The processing technology can be referred to the following: 

Cutting: the original material of wafers can be in forms of plates, strips or rods, which need to be cut according to the required diameter and thickness of the wafers. Cutting can be done by mechanical shearing or laser cutting.

Extrusion or cold rolling: wafers need to be deformed to obtain the required dimensions and properties. Extrusion or cold rolling are commonly used texturing methods that allow the wafer to achieve a smaller thickness while increasing its strength and hardness.

Finishing: the surface of the wafer needs to be finished, usually by grinding and polishing, to eliminate the surface defects that may be left in the process of cutting, extrusion or cold rolling, and improve the surface finish and flatness of the wafer.

Cleaning and packaging: they need to be cleaned after processing to remove impurities and residues generated during processing. After cleaning, they need to be packaged, usually with anti-rust paper and plastic bags to protect the surface from oxidation and pollution.

Molybdenum wafers are mainly used as substrates of silicon controlled rectifier (SCR). Because there are many types of silicon rectifiers with different specifications, the specifications as substrates are also relatively wide. The diameter is generally 4-100mm and the thickness is 0.1-3.0mm. However, with the continuous and rapid development of the semiconductor industry, the market demand for moly wafers larger than φ76.2mm, such as φ100mm, is increasing year by year.

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