Why Molybdenum Wafer Can Be for Bonding to LED Chips?

Molybdenum wafer is a flake-shaped molybdenum material, usually with a thinner thickness and larger diameter. It is usually used in applications under high temperature, high pressure and strong corrosive environment, such as aviation, aerospace, electronics, chemical industry and other fields, and is manufactured through molybdenum material processing technology, such as rolling, drawing and other methods.

It can vary in size depending on specific application needs. Normally, its thickness can range from 0.05mm to 10mm, and the diameter can be large to 300mm. For some applications with special requirements, the size of the molybdenum wafer may need to be larger or smaller, and more precise control is also required. Its size can be selected according to the standard size provided by the manufacturer, or can be customized to meet the specific application requirements.

There are many characteristics of this material as following: 

High melting point: the melting point of molybdenum is 2610°C, which is one of the highest melting points among all metals.

High hardness: its Mohs hardness is between 6.5 and 7.5, which is harder than ordinary steel.

Good corrosion resistance: it can be used in some strongly corrosive environments, such as strong acid and strong alkali environments.

Low thermal expansion coefficient: its thermal expansion coefficient is relatively small, relatively stable, and can be used at high temperatures.

Good electrical conductivity: it can maintain good electrical conductivity at high temperature.

High strength: it has high strength and can withstand large external forces. At the same time, it has good toughness and are not easy to break.

A light-emitting diode (LED) is a semiconductor device that emits visible light when an electric current passes through it. Pure molybdenum is the ideal material as carrier wafers for bonding to LED chips because of the above good characteristics. 

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