What Are the Benefits of Metal Plating on Molybdenum Copper Alloy

Molybdenum is a non-ferrous metal with high melting point, high strength, high hardness, wear resistance, and good thermal and electrical conductivity, while molybdenum copper alloy (Cu-Mo alloy) is a pseudo-alloy made by copper and molybdenum that does not solidify with each other.

This alloy contains less copper, so it basically possesses most of the physical and chemical properties of molybdenum, and also has the characteristics of copper at the same time, that is, it has high electrical conductivity, high thermal conductivity, small expansion coefficient, good corrosion resistance, non-magnetic and good processing properties, etc.

Given the broad application prospects., the material is widely used in many fields such as metallurgy, machinery, petroleum, chemical industry, national defense, aerospace, electronics, nuclear industry and so on. There are mainly: vacuum contacts, conductive heat dissipation components, instrumentation components, rockets that are used at a slightly lower temperature, high-temperature components of missiles, and components in other weapons, such as range extenders. At the same time, it is also used for solid sealing, sliding friction reinforcing ribs, water-cooled electrode heads in high-temperature furnaces, and electro-machined electrodes.

In actual use, molybdenum-copper alloys are often subjected to surface modification treatments such as electroplating and coating to meet specific functional requirements on their surfaces, such as high-temperature brazing and reducing contact resistance. However, the surface of Cu-Mo alloy is very easy to oxidize, and the chemical properties of the oxide film are very stable, the surface wettability is poor, and it is very difficult to perform surface treatment. Therefore, the gold plating can greatly improve its conductivity and brazing performance. It meets the application requirements in military electronics and aerospace products.

For regular metal plating, Ni, NiAu, NiAg, or Au plating are the most common. The thickness of plating is about 3~5 microns and gold plating is about 1 micron. Sometimes, AuSn plating is required. 

Chinatungsten Online can provide customized molybdenum copper alloy with effective thermal conductivity and good high-temperature tolerance.

If you have any inquiry of gold plated molybdenum copper carrier, please feel free to contact us:
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Cu/Mo/Cu Heat Sink (CMC) for Radio Frequency and Lead Frames

High power electronics and circuits generate a lot of heat during operation. The heat sink materials help to eliminate the heat of the chip, transfer it to other media, and maintain the stable operation of the chip.

Tungsten-copper and molybdenum-copper alloy are the most common heat sink materials, which are a kind of heat sink substrate commonly used for high airtight packaging such as CPU, IC, solid microwave tube. This material has a thermal expansion coefficient and high thermal conductivity that match different substrates; excellent high temperature stability and uniformity; excellent processing performance.

Cu/Mo/Cu heat sink (CMC) is a composite material with a similar sandwich structure, the core material is molybdenum, and both sides are covered with copper. The basic concept of the design is to use the high thermal conductivity of copper and the low thermal expansion characteristics of molybdenum. By adjusting the thickness ratio of copper, molybdenum and copper, it can achieve a thermal expansion coefficient matching ceramic materials and semiconductor materials, and a higher thermal conductivity. The expansion coefficient and thermal conductivity are designable. 

At present, the CMC products are mainly used in radio frequency, microwave and semiconductor high-power devices, heat sinks, lead frames, low-expansion layers and heat conduction channels of multilayer printed circuit boards (PCBs).

As the thermal conductivity of molybdenum is unsatisfactory, so people strive to improve it. In order to improve its thermal conductivity and heat dissipation performance, it is usually used to increase the copper content. However, the increase in copper content can improve the thermal conductivity, but as another performance requirement, the linear expansion coefficient CTE is required to match the chip as much as possible. However, excessively increasing the copper content will result in a mismatch between the linear expansion coefficient and the chip. The long-term thermal expansion and contraction process will easily cause the chip to be damaged and invalid due to inconsistent thermal expansion. 

The ideal heat sink material should have a linear expansion coefficient CTE, which is basically matched with the chip, and has the highest possible thermal conductivity, especially the Z-direction (thickness) thermal conductivity, so that the heat of the packaged chip and other electronic devices can be quickly discharged. In order to increase its power density, achieve high power, reduce the volume and realize the miniaturization of the device. CMC material is now the one of the materials to meet above requirements.  

If you have any inquiry of Cu/Mo/Cu heat sink, please feel free to contact us:
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What Do You Know About the Disadvantages of TZM Plate or Sheet?

TZM alloy is an attractive molybdenum-based alloy (0.4-0.54% Ti, 0.06-0.12 %Zr, 0.01-0.04% C, balance Mo) utilized in industries with high strength, high temperature and vacuum requirements, including aerospace, electronics and heat treatment. TZM alloy plate can perfectly server these areas when the working temperature ranges from 700 ℃ to 1400 ℃。

Compared with pure molybdenum plate, TZM plate has a more stable crystal structure and a higher recrystallization temperature. This is due to the small amount of zirconium and titanium doped in the molybdenum substrate. In addition, the extremely fine-sized composite carbides Mo2C, TiC and ZrC refine and suppress the molybdenum grains, so that alloy plate has better weldability and creep resistance than the pure molybdenum plate.

However, there are still many disadvantages for this material. 

1. Oxidation. Although the material can be used in the temperature above 2000℃,the premise is that its working environment is vacuumed or under the protection of nitrogen, cracked ammonia or other atmosphere. Molybdenum alloy plates will start to oxide at about 400 ℃ and become to fast at about 700 ℃. If they work at above 2000 ℃, they will oxide immediately. 

2, Welding. Molybdenum or tungsten products can be welded, but require certain equipment and technology. Normally, the technology includes cooling welding and vacuum welding with pointed welding wire. Silver, stainless steel or structural alloy steel can not be the material of wire. It must be with very high melting point and strength, such as TZM. 

3, Form. The form of TZM alloy products is limited as they can not be bent even with small angles. If a product requires to be bent into certain shapes, it should be through riveting or welding together two parts. 

Apart with plates, TZM mill products available from either process include forging billets, bar, rod, sheet and foil. All forms in basically the same size range as pure molybdenum with the exception of thin foil. 

If you have any inquiry of TZM plate, please feel free to contact us:

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