Molybdenum Electrode Price in Early February 2024

Ø60x650mm molybdenum electrode price is 1,500.00 USD/PC in Early February 2024. This kind of electrode has been widely used in glass melting for many years. 

The electrode made of molybdenum has good advantages of high melting point, high strength and hardness at high temperature, as well as good electrical and thermal conductivity and good corrosion resistance. The use of moly electrodes to replace the original heavy oil and gas energy can effectively reduce environmental pollution and improve the quality of glass. Molybdenum electrode rod is a kind of molybdenum electrode product, its surface is bright gray metallic luster with density more than 10.15g/cm3. They are mainly used for electric glass furnaces, electric light sources and electric vacuum parts.

If you have any inquiry of molybdenum electrode, please feel free to contact us:
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Cu/Mo/Cu Carrier Price in Early February 2024

8.6x11x0.5mm Cu/Mo/Cu carrier price is 4.00 USD/PC in in Early February 2024. These carriers are mainly used in radio frequency, microwave and semiconductor high-power devices, carriers, lead frames, low-expansion layers and heat conduction channels of multilayer printed circuit boards (PCBs).

Cu/Mo/Cu carrier (CMC) is a composite material with a similar sandwich structure, the core material is molybdenum, and both sides are covered with copper. The basic concept of the design is to use the high thermal conductivity of copper and the low thermal expansion characteristics of molybdenum. By adjusting the thickness ratio of copper, molybdenum and copper, it can achieve a thermal expansion coefficient matching ceramic materials and semiconductor materials, and a higher thermal conductivity. The expansion coefficient and thermal conductivity are designable.

The ideal carrier material should have a linear expansion coefficient CTE, which is basically matched with the chip, and has the highest possible thermal conductivity, especially the Z-direction (thickness) thermal conductivity, so that the heat of the packaged chip and other electronic devices can be quickly discharged. In order to increase its power density, achieve high power, reduce the volume and realize the miniaturization of the device. CMC material is now the one of the materials to meet above requirements.  

If you have any inquiry of molybdenum copper carriers, please feel free to contact us:

Email: sales@chinatungsten.com/sales@xiamentungsten.com

Tel.: +86 592 5129696/+86 592 5129595

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