0.4x3.715x1.5mm Cu/Mo/Cu heat sink price is 1.10USD/PC on July 26, 2022. They are mainly used in radio frequency, microwave and semiconductor high-power devices, heat sinks, lead frames, low-expansion layers and heat conduction channels of multilayer printed circuit boards (PCBs).
Cu/Mo/Cu heat sink (CMC) is a composite material with a similar sandwich structure, the core material is molybdenum, and both sides are covered with copper. The basic concept of the design is to use the high thermal conductivity of copper and the low thermal expansion characteristics of molybdenum. By adjusting the thickness ratio of copper, molybdenum and copper, it can achieve a thermal expansion coefficient matching ceramic materials and semiconductor materials, and a higher thermal conductivity. The expansion coefficient and thermal conductivity are designable.
The ideal heat sink material should have a linear expansion coefficient CTE, which is basically matched with the chip, and has the highest possible thermal conductivity, especially the Z-direction (thickness) thermal conductivity, so that the heat of the packaged chip and other electronic devices can be quickly discharged. In order to increase its power density, achieve high power, reduce the volume and realize the miniaturization of the device. CMC material is now the one of the materials to meet above requirements.
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