Copper Molybdenum Copper Packaging Martial

Copper molybdenum copper (CMC) packaging material is kind of composite sandwich flat structure, which uses pure molybdenum as core material, double-sided coated with copper or copper dispersion strengthened.

Thermal expansion coefficient of this material is adjustable and it also has high thermal conductivity, excellent high temperature and other good performance, has been widely used in electronic packaging. CMC Material is metal matrix flat layered composite electronic packaging materials. The structure of this electronic packaging composite materials are stacked, generally divided into three layers.

The intermediate layer is a low expansion material layer and on both sides of the high electrical and thermal conductivity material layer. On the other hand, there are two, or four composite laminates of this material. Commonly use rolling composite method, plating composite method, explosive forming method and other processing method to produce. These materials have good thermal conductivity and low coefficient of expansion in the planar direction, and basically there are no dense problems, in addition, the processing cost of it is relatively low. For example, there can be continuous rolling to compounding produce rolls / Invar / Cu composite sheet, which can greatly reduce production costs and it also can be processed into 70um foil, widely used in the core layer PCB and lead frame material.

Because the CMC material has high theoretical thermal conductivity, coefficient of expansion and matched to Si, back in the 1990s, experts and scholars employed a in-depth study, the United States AMAX company and Climax Specialty Metals company use hot rolling complex method produced CMC composites, and applied for a patent, has been used in the electronic device B2 stealth bomber. CMC structure and CIC are the same as three-layer composite structure, but the hardness, tensile strength, heat and electrical conductivity much higher than the CIC, it is because the middle of the CMC is molybdenum plate, molybdenum and strength, electrical conductivity, and thermal conductivity are higher than Inar alloys.

CMC electronic packaging materials having excellent thermal conductivity and adjustment thermal expansion coefficient, currently is the preferred electronic packaging materials in high-power electronic components among domestic and international. Besides, it can match with Be0, Al203 ceramics, widely used in microwave, communications, aerospace, power electronics, high-power semiconductor lasers, medical and other industries. In addition, in microwave packaging and radio frequency field also extensive use CMC material as the heat sink material. In military electronic devices, it is often adopted as a highly reliable circuit board substrate material.

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