With the rapid development of science, technology and cutting-edge industries, especially the development of the electronics industry by leaps and bounds, put forward newer and higher requirements electronic packaging materials performance. Packaging materials are not only required to match the thermal expansion coefficient of the packaged device, but is required to have high thermal conductivity, non-magnetic, heat resistance, corrosion resistance and other special properties.
Molybdenum copper (Mo-Cu) alloy is a binary and mutually insoluble pseudo alloy and it has high melting point, high density, good electrical conductivity, good thermal conductivity, adjustment coefficient of expansion and other advantages. So it is widely used in aerospace, metallurgy, electric power, electronics and semiconductor industries, especially plays an important role in the electronics, semiconductor industry and pays close attention to all developed countries.
Producing
ultra-fine molybdenum copper powder not only can refine powder size and powder will become more uniformity, so it can improve the density and organization uniformity. Ultra-fine powder can obtained molybdenum copper alloy which has near the theoretical density. Besides, the copper will distributed around and molybdenum evenly, forming the ideal network-like structure.
In order to find the optimum method for preparing ultra-fine molybdenum copper powder, using scanning electron microscopy and transmission electron microscopy studies the effects of different milling ways and different milling on molybdenum copper powder’s morphology and particle size.
If you have any inquires concerning molybdenum products, please don't hesitate to e-mail us by :
sales@chinatungsten.com or
info@chinatungsten.com
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